Description
GL12 Solderless Breadboard – 840 Tie-Points Prototype Board
The GL12 Solderless Breadboard is a high-quality 840 tie-point prototyping board designed for rapid electronic circuit assembly, testing, and educational experiments without the need for soldering. Featuring durable nickel-plated spring contacts and clear alphanumeric grid markings, this breadboard ensures reliable conductivity and easy component placement for microcontrollers, sensors, ICs, and discrete components.
Technical Specifications
| Parameter | Specification |
|---|---|
| Model | GL12 |
| Total Tie-Points | 840 Points (128 Terminal Groups + Power Rails) |
| Pitch Standard | 2.54 mm (0.1 in) Standard Pin Spacing |
| Wire Gauge Range | 21 AWG to 26 AWG (0.4 mm to 0.7 mm) |
| Contact Material | Phosphor Bronze, Nickel-Plated Clips |
| Base Material | ABS Plastic (Flame Retardant) |
Key Performance Advantages
- 840 tie-points provide ample space for complex circuit layouts and modular testing
- Solderless design enables fast insertion, removal, and reconfiguration of components
- Self-adhesive backing foam layer allows secure mounting onto baseplates or workbenches
- Standard 0.1-inch pitch provides full compatibility with DIP ICs, Arduino headers, and jumper wires
- Interlocking edge tabs allow multiple breadboards to be connected for expanded projects
Typical Applications
- Arduino, Raspberry Pi, and microcontroller circuit prototyping
- STEM electronics education, university laboratories, and DIY maker projects
- Analog and digital circuit design validation and debugging
- Sensor integration and embedded systems testing
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